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The ET-501P is a dedicated production machinedesigned to eutectically bond the submount and chip(LD) onto a TO56 header through a controlled heating process.
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ET-503 25G Base Assembly DieBonder is designed for the eutectic assembly of 25G TO56 and TO60 bases with large heat sinks. This automated production system bonds multiple solder preforms between the 25G large heat sink and the TO56 or TO60 base through co
PH-550P is a eutectic bonding machineused in COB and COC processes. It bonds the substrate and chip by melting solder according to a controlled temperature profile after CCD-based positioning.The system is primarily composed of a eutectic bonding stage, c
1, PH-100是COC等制程中將耐高溫基底與芯片，經(jīng)過控制溫度曲線熔化焊料從而鍵合在一-起的共晶設(shè)備。 2,設(shè)備主要由共晶臺，貼片吸嘴組件，對位CCD，脈沖加熱系統(tǒng)等組成。 3,共晶臺包含X、Y、T三軸系統(tǒng)組成，上面設(shè)置共晶加熱模塊，冷氮?dú)猸h(huán)境保護(hù)系統(tǒng)，共晶臺冷卻系統(tǒng)。 4,貼片吸嘴組件設(shè)在Z軸上……
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RD-800 is a fully automatic multifunctional die bonder designed for high-precision multi-chip placement in packaging processes.
RD-3000 is a versatileeutectic die bondersuitable for adhesiveand eutectic chip packaging processes. ● Automatic nozzle change mechanism. ● Air-floating bonding head mechanism to ensure placement accuracy and consistent bonding pressure. ● Compat
● Supports placement of multiple chip types simultaneously● Equipped with an auto-zoom motorized lens to accommodate different component sizes● Programmable operation for various process requirements
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The substrate is manually placed into the substrate fixture, which is then loaded into the automatic loading/unloading magazine. Chip trays or blue tapes are also manually loaded.
DB-560P is a production machinedesigned for COB/COC processes, bonding substrates (PCBs or other materials) to chips using an automated dispensing process.Manual Loading:Place the substrate tray into the feed cassette, then install the cassette onto the c
This machineis an automated production system designed to bond TO sockets to chips through a dispensing process after rotating the TO sockets to a specified angle (?) during the manufacturing process.Manual Loading:Place the TO socket strips into the carr
設(shè)備簡介： 應(yīng)用：IGBT及其它金屬零件焊接 功能優(yōu)勢： 實(shí)現(xiàn)IGBT端子全自動焊接工序。 包含焊前清潔，焊后清潔。 實(shí)現(xiàn)自動上下料，可連續(xù)工作。 圖像處理功能，保證焊接位置準(zhǔn)確性及實(shí)現(xiàn)自動焊接。 焊接壓力150-650N，焊接功率2400W。 可精確動態(tài)力控制及……
● Utilizes an ultrasonic welding process optimized for pins – torque welding process. ● Full-process monitoring of pressure, energy, and time ensures welding quality. ● Automatic loading/unloading, automatic alignment, and automatic welding. ● In