Fully Automatic TO56 Eutectic Bonder ET-501P

High-Precision Eutectic Die Bonder

The ET-501P is a dedicated production machinedesigned to eutectically bond the submount and chip(LD) onto a TO56 header through a controlled heating process.

TO Base Assembly Die Bonder 25G ET-503

High-Precision Eutectic Die Bonder

ET-503 25G Base Assembly DieBonder is designed for the eutectic assembly of 25G TO56 and TO60 bases with large heat sinks. This automated production system bonds multiple solder preforms between the 25G large heat sink and the TO56 or TO60 base through co

Fully Automatic Pulse-Heating Eutectic Bonder PH-550P

High-Precision Eutectic Die Bonder

PH-550P is a eutectic bonding machineused in COB and COC processes. It bonds the substrate and chip by melting solder according to a controlled temperature profile after CCD-based positioning.The system is primarily composed of a eutectic bonding stage, c

Manual pulse heating eutectic machine

High-Precision Eutectic Die Bonder

1, PH-100是COC等制程中將耐高溫基底與芯片，經(jīng)過(guò)控制溫度曲線熔化焊料從而鍵合在一-起的共晶設(shè)備。 2,設(shè)備主要由共晶臺(tái)，貼片吸嘴組件，對(duì)位CCD，脈沖加熱系統(tǒng)等組成。 3,共晶臺(tái)包含X、Y、T三軸系統(tǒng)組成，上面設(shè)置共晶加熱模塊，冷氮?dú)猸h(huán)境保護(hù)系統(tǒng)，共晶臺(tái)冷卻系統(tǒng)。 4,貼片吸嘴組件設(shè)在Z軸上……