- Sales Hotline：18898580916
.jpg)
.jpg)
High-Precision Eutectic Die Bonder
ET-503 25G Base Assembly Die Bonder is designed for the eutectic assembly of 25G TO56 and TO60 bases with large heat sinks. This automated production system bonds multiple solder preforms between the 25G large heat sink and the TO56 or TO60 base through controlled heating, ensuring precise and reliable assembly.
Product Details
Machine Specifications:
Dimensions (mm): X 1640 Y 1320 Z 1850
Weight: 1200 kg
Power: 6 kW
Air Pressure: 0.4–0.6 MPa
Voltage: 220 V
Production Efficiency: 300 eutectic assemblies per hour (each consisting of one heatsink and three solder preforms).
Positioning Accuracy: ±15 μm
Angular Accuracy: ±1°
Die Bonding Pressure: 10–15 g
Wafer Size: 6" (tray 2" × 2")
Chip Size: 0.2–1 mm
