RD-3000 Versatile Eutectic Die Bonder

Fully Automatic Multi-Function Die Bonder

RD-3000 is a versatile eutectic die bonder suitable for adhesive and eutectic chip packaging processes.

● Automatic nozzle change mechanism.

● Air-floating bonding head mechanism to ensure placement accuracy and consistent bonding pressure.

● Compatible with clip carriers, waffle trays, blue film, and feeder supply systems.

● Substrate carriers are supplied via conveyor line; carriers are compatible with sensitive substrates sized 200 × 300 mm.

● Optional multi-zone heating platform.

● Supports die attach with adhesive dipping and dispensing; up to three glue trays can be accommodated.

● Front and back side chip recognition, suitable for both face-up and flip-chip processes.

● Production process is programmable to accommodate multiple materials and process requirements.

● Graphical recognition is programmable to meet precise alignment and inspection needs.

● Supports 12-inch and 8-inch wafers, including die singulation, rotation, and barcode scanning.